Lens driving device, camera module and optical apparatus

ABSTRACT

A lens driving device is provided, including: a holder member; a first driving unit disposed at the holder member; a base disposed at a lower side of the holder member and spaced apart from the holder member; a first circuit board disposed at an upper surface of the base; a second circuit board including a second driving unit facing the first driving unit, and disposed at an upper surface of the first circuit board; a support member supporting the holder member with respect to the base; and a guide portion protruded from an upper surface of the base, wherein the guide portion supports the second circuit board. In an embodiment, a coil at the second circuit board and a magnet at the holder member may be assembled at a predetermined interval, such that reliability of the product with respect to performance of handshake compensation device can be enhanced.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No.16/683,581, filed Nov. 14, 2019; which is a continuation of U.S.application Ser. No. 15/000,613, filed Jan. 19, 2016, now U.S. Pat. No.10,520,699, issued Dec. 31, 2019; which claims the benefit under 35U.S.C. § 119 of Korean Application Nos. 10-2015-0007754, filed Jan. 16,2015; and 10-2015-0011858, filed Jan. 26, 2015, all of which are herebyincorporated by reference in their entirety.

TECHNICAL FIELD

The present exemplary embodiments relate to a lens driving device, acamera module and an optical apparatus.

BACKGROUND

The technology described in this section is merely intended to providebackground information of an exemplary embodiment of the presentdisclosure, and does not mean the prior art.

Concomitant with wide propagation of various mobile terminals andcommercialization of wireless Internet services, demands by consumersrelated to the mobile terminals are diversified, and various types ofadditional equipment are attached to the mobile terminals.

Among the various types of additional equipment, a camera module may bea representative device capable of editing and transmitting a stillimage or a moving picture, as necessary, by photographing the stillimage or the moving picture, and storing the still image or the movingpicture in image data.

A camera module may include an image sensor, a PCB (Printed CircuitBoard) configured to deliver electric signals to the image sensorinstalled on the PCB, an infrared cut-off filter configured to blocklight in infrared area from being incident on the image sensor, and anoptical system including at least one lens configured to deliver animage to the image sensor. Here, a lens driving device configured toperform auto-focusing function and handshake compensation function maybe installed in the optical system.

The lens driving device may be composed of by a variety of ways. Ingeneral, a voice coil motor is commonly used in the lens driving device.The voice coil motor operates by an electromagnetic interaction betweena magnet fixed in a housing and a coil unit wound on an outercircumferential surface of a bobbin coupled with a lens barrel. Thevoice coil motor may perform auto-focusing function. An actuator moduleof such voice coil motor may reciprocatively move in a directionparallel to an optical axis while a bobbin being moved in upward anddownward directions is elastically supported by an upper and a firstelastic member.

However, those components may have height deviations depending uponassembly workers, during the process of laminating a plurality ofcircuit boards on the base in order to implement the handshakecompensation function. This is a problem lying in the conventionaltechnology.

Meanwhile, the FPCB (Flexible Printed Circuit Board) used in the lensdriving motor is coupled to the OIS (Optical Image Stabilization) coilvia a plurality of soldering. Thereby, circuits of the FPCB and the OIScoil are connected to each other.

However, there is still a problem in that the FPCB soldered to the OIScoil may be cracked when an impact such as dropping is applied to thelens driving motor for reliability of the lens driving motor.

BRIEF SUMMARY

In order to solve the problem described in the above, according to anexemplary embodiment, a lens driving device having auto focus andhandshake compensation functions is provided.

In addition, according to an exemplary embodiment, there is provided alens driving device where a distance between a driving magnet and an FP(Fine Pattern) coil can be stably maintained during assembly process.

According to an exemplary embodiment, there is provided a lens drivingdevice that can inhibit cracking in the FCPB even when an impact such asdropping is applied to the lens driving device.

In a general aspect, a lens driving device is provided, comprising: abase; a bobbin disposed at au upper side of the base, and so installedas to be movable upward and downward relative to an optical axis, wherea coil unit may be wound on an outer circumferential surface of thebobbin; a holder member including a magnet arranged at a position at aposition facing the coil unit; an upper elastic member and a lowerelastic member, where one end of each of the upper and the lower elasticmembers may be respectively coupled to the bobbin and the holder memberand elastically supporting the bobbin; a sensing unit arranged at aposition facing the magnet of the bobbin and configured to sense changein magnetic force of the magnet; and a handshake compensation meansinstalled at the base and move the holder member in a directionperpendicular to the optical axis, wherein the handshake compensationmeans includes: a first circuit board accommodated at the base; a secondcircuit board integrally formed with the second coil; and a first guideportion protruded on the base and guiding an installed position of thefirst circuit board and the second circuit board, wherein an uppersurface of the first guide portion may penetrate through the firstcircuit board and surface-contact a bottom surface of the second circuitboard.

In some exemplary embodiments, the first circuit board may furtherinclude a first guide groove through which the first guide portionpenetrates.

In some exemplary embodiments, the first circuit board may include: afirst connecting portion connected to a conductive connecting portionprovided at the base.

In some exemplary embodiments, the second circuit board may include: asecond connecting portion arranged at a position corresponding to thatof the first connecting portion, and conductively connected to the firstconnecting portion and the conductive connecting portion.

In some exemplary embodiment, the sensing unit may include: a sensingmagnet installed at an outer circumferential surface of the bobbin; anda position detection sensor disposed at an inner surface facing thesensing magnet.

In some exemplary embodiments, the cover member may be formed as aferromagnetic body.

In some exemplary embodiments, the bobbin may be arranged at a positionwhere the sensing magnet is not interfered with the coil unit.

In some exemplary embodiments, the sensing magnet and the correctionmagnet may be so arranged as not to face the magnet.

In some exemplary embodiments, the position detection sensor may beprovided as a Hall sensor.

In another general aspect, there is provided a camera module,comprising: an image sensor, a PCB including the image sensor mountedthereon; and a first lens driving device configured as described in theabove.

In still another general aspect, there is provided a lens drivingdevice, comprising: a coil unit configured to generate electromagneticfield when electric power is supplied; a base layer; a circuit layerlaminated on the base layer; a cover layer laminated on the circuitlayer; a copper portion provided at an edge of the and coupled by beingsoldered to the coil unit; and an FPCB coupled to the coil unit andconfigured to supply electric power to the coil unit, wherein the copperportion may be disposed at a first surface of the base layer, a secondsurface facing the first surface, and a third surface connecting thefirst surface and the second surface.

In some exemplary embodiments, a part of the copper portion may bedisposed between the base layer and the cover layer.

In some exemplary embodiments, the FPCB may include a penetration holepenetrating through the FPCB, and the copper portion may be disposed atan outer edge or at an edge of the penetration hole.

In some exemplary embodiments, the base layer may be formed of apolyimide.

In still another exemplary embodiment, there is provided a lens drivingdevice, comprising: a coil unit configured to generate electromagneticfield when electric power is supplied; a base layer; a circuit layerlaminated on the base layer; a cover layer laminated on the circuitlayer; a copper portion provided at an edge of the and coupled by beingsoldered to the coil unit; and a first FPCB and a second FPCB coupled tothe coil unit and configured to supply electric power to the coil unit,wherein the copper portion may be disposed at a first surface of a baselayer of the first FPCB, a second surface of a base layer of the secondFPCB facing the first surface, and a third surface connecting a lateralportion connected from the first surface and a lateral portion connectedfrom the second surface.

In some exemplary embodiments, a part of the copper portion may bedisposed between the base layer of the firsts FPCB and the cover layer,or between the base layer of the second FPCB and the cover layer.

In some exemplary embodiment, the first FPCB and the second FPCB mayinclude a penetration hole penetrating therethrough, and the copperportion may be disposed at an outer edge of base layer or at an edge ofthe penetration hole.

In some exemplary embodiments, the base layer may be formed of apolyimide.

In still another general aspect, there is provided a lens drivingdevice, comprising: a holder member; a first driving unit disposed atthe holder member; a base disposed at a lower side of the holder memberand spaced apart from the holder member; a first circuit board disposedat an upper surface of the base; a second circuit board including asecond driving unit facing the first driving unit, and disposed at anupper surface of the first circuit board; a support member supportingthe holder member with respect to the base; and a guide portionprotruded from an upper surface of the base, wherein the guide portionmay support the second circuit board.

In some exemplary embodiments, an upper surface of the guide portion maycontact a lower surface of the second circuit board.

In some exemplary embodiments, the base may include an openingpenetrating through an inside of the base in a vertical direction, andthe guide portion may include a first guide portion contacting an innercircumferential surface forming the opening of the base and a secondguide portion contacting an outer circumferential surface of the base.

In some exemplary embodiments, the first guide portion may include aplurality of guide protrusions, and the plurality of guide portions maybe arranged along the inner circumferential surface of the base by beingspaced apart from each other.

In some exemplary embodiments, the first circuit board may include afirst guide groove through which the first guide portion penetrates.

In some exemplary embodiments, the second guide portion may be extendedalong an outer circumferential surface of the base.

In some exemplary embodiment, the first circuit board may not beoverlapped with the second guide portion in a vertical direction.

In some exemplary embodiments, the first circuit board may include afirst connecting portion, and the second circuit board may include asecond connecting portion arranged at a position corresponding to thatof the first connecting portion and conductively connected with thefirst connecting portion.

In some exemplary embodiments, the support member may be conductivelyconnected with at least one of the first connecting portion and thesecond connecting portion.

In some exemplary embodiments, the base may include a grooved portionformed by being recessed downward from an upper surface, the firstconnecting portion and the second connecting portion may be connected toeach other by soldering, and the first circuit board may be fixed bybeing adhered to an epoxy disposed at the grooved portion.

In some exemplary embodiments, the lens driving device may furthercomprise: a bobbin disposed at an inside of the holder member; a thirddriving unit disposed at the bobbin, and facing the first driving unit;an upper elastic member coupled to an upper portion of the holder memberand an upper portion of the bobbin; and a lower elastic member coupledto a lower portion of the holder member and a lower portion of thebobbin.

In some exemplary embodiments, the lens driving device may furthercomprise: a sensing magnet disposed at a lateral surface of the bobbin;a correction magnet disposed at another lateral surface of the bobbin,and establishing magnetic force equilibrium with the sensing magnet; anda position detection sensor disposed at the holder member, andconfigured to detect the sensing magnet.

In some exemplary embodiments, the first driving unit may include amagnet, the second driving unit may include a fine pattern coil, and thethird driving unit may include a coil.

In still another general aspect, there is provided a camera module,comprising: a holder member; a first driving unit disposed at the holdermember; a base disposed at a lower side of the holder member by beingspaced apart from the holder member; a first circuit board disposed atan upper surface of the base; a second circuit board including a seconddriving unit facing the first driving unit, and disposed at an uppersurface of the first circuit board; a support member supporting theholder member with respect to the base; and a guide portion protrudedfrom an upper surface of the base, wherein the guide portion may supportthe second circuit board.

In still another general aspect, there is provided an optical apparatus,comprising: a holder member; a first driving unit disposed at the holdermember; a base disposed at a lower side of the holder member by beingspaced apart from the holder member; a first circuit board disposed atan upper surface of the base; a second circuit board including a seconddriving unit facing the first driving unit, and disposed at an uppersurface of the first circuit board; a support member supporting theholder member with respect to the base; and a guide portion protrudedfrom an upper surface of the base, wherein the guide portion may supportthe second circuit board.

According to an exemplary embodiment, during assembly process, an uppersurface of the first guide portion integrally formed with the base maybe so assembled as to penetrate through the first circuit board and asto surface-contact a bottom surface of the second circuit board.Therefore, the second coil disposed at the second circuit board and themagnet disposed at the holder member may be assembled at a predeterminedinterval, such that reliability of the product with respect toperformance of handshake compensation device can be enhanced. Inaddition, the position information of the bobbin and the holder membercan be correctly received as a feedback.

According to an exemplary embodiment, the cover layer of the FPCB usedin the lens driving device may be so extended not only as to cover thecircuit layer, but also as to cover an end of the copper portion.Thereby, the FCPB can be inhibited from being cracked even when animpact such as dropping is applied to the lens driving device, and thereliability of the product can be enhanced as well.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a schematic perspective view illustrating a camera moduleaccording to a first exemplary embodiment.

FIG. 2 is an exploded perspective view of FIG. 1.

FIG. 3 is a magnified perspective view illustrating a bobbin of FIG. 2.

FIG. 4 is a magnified perspective view illustrating a holder member ofFIG. 2.

FIG. 5 is a perspective view illustrating a base and a holder memberaccording to a first exemplary embodiment.

FIG. 6 is an essential cross-sectional view of FIG. 5.

FIG. 7 is a perspective view illustrating a base according to a firstexemplary embodiment.

FIG. 8 is a plan view illustrating a first circuit board according to afirst exemplary embodiment.

FIG. 9 is a plan view illustrating a second circuit board according to afirst exemplary embodiment.

FIG. 10 is an exploded perspective view illustrating a lens drivingdevice according to a second exemplary embodiment.

FIG. 11 is a plan view illustrating a coupled state between an FPCB andan OIS coil of a lens driving device according to a second exemplaryembodiment.

FIG. 12 is a cross-sectional view illustrating an FPCB of a lens drivingdevice according to a second exemplary embodiment.

FIG. 13 is a cross-sectional view illustrating an FPCB of a lens drivingdevice according to a third exemplary embodiment.

DETAILED DESCRIPTION

Hereinafter, exemplary embodiments of the present disclosure will bedescribed with reference to the exemplary drawings. In designatingelements in the drawings as reference numerals, wherever possible, thesame reference numerals are used to refer to the same element, eventhough the same elements are illustrated in different drawings. Inaddition, in describing exemplary embodiments of the present disclosure,when it is determined that a detailed description about known functionor structure relating to the present disclosure may disturbunderstanding of exemplary embodiments of the present disclosure, thedetailed description may be omitted.

In addition, in describing elements of exemplary embodiments of thepresent disclosure, the terms such as “first”, “second” “A”, “B”, “(a)”and “(b)” may be used. However, such terms are used merely todistinguish a particular element from another element, and therefore,essence, order or sequence of the relevant elements shall not be limitedby the terms. It will be understood that when an element is referred toas being “connected”, “contacted” or “coupled” to another element, itcan be directly connected, contacted or coupled to the other elements,or otherwise, an intervening elements may be “connected”, “contacted” or“coupled” between the element and the other element.

As used herein, the term “optical axis direction” is defined as adirection of an optical axis of a lens module installed at a lensactuator. Meanwhile, the term “optical axis direction” may be used incombination with the terms such as “up/down direction”, “z-axisdirection”, etc.

As used herein, the term “auto focus function” is defined as a functionto focus on the subject by moving the lens module in the optical axisdirection according to distance to the subject to adjust the distancebetween an image sensor and the subject, in order to form a clear imageon the image sensor. Meanwhile, the term “auto focus” may be used incombination with the term “AF (Auto Focus)”.

As used herein, the term “handshake compensation function” is defined asa function to move or tilt the camera module in a directionperpendicular to the optical axis direction so as to counterbalancetrembling (motion) generated by the image sensor due to external force.Meanwhile, the term “handshake compensation” may be used in combinationwith the term “OIS (Optical Image Stabilization)”.

First Exemplary Embodiment

Hereinafter, a structure of a lens driving device according to a firstexemplary embodiment will be described with reference to encloseddrawings.

FIG. 1 is a schematic perspective view illustrating a camera moduleaccording to a first exemplary embodiment; FIG. 2 is an explodedperspective view of FIG. 1; FIG. 3 is a magnified perspective viewillustrating a bobbin of FIG. 2; FIG. 4 is a magnified perspective viewillustrating a holder member of FIG. 2; FIG. 5 is a perspective viewillustrating a base and a holder member according to a first exemplaryembodiment; FIG. 6 is an essential cross-sectional view of FIG. 5; FIG.7 is a perspective view illustrating a base according to a firstexemplary embodiment; FIG. 8 is a plan view illustrating a first circuitboard according to a first exemplary embodiment; and FIG. 9 is a planview illustrating a second circuit board according to a first exemplaryembodiment.

The first lens driving unit (1001) may include a base (1020), a bobbin(1030), and a holder member (1040). In addition, a cover member (1060)may be additionally provided to form an external appearance of thecamera module. A holder member (1040) supporting a magnet (1041) may bearranged inside of the cover member (1060).

The base (1020) may be coupled to the cover member (1060).

The bobbin (1030) may be installed in an internal space of the covermember (1060) to be reciprocatively movable in an optical axisdirection. A first coil (1031) may be installed at a coil accommodationportion (1030 a) formed on an outer circumferential surface of thebobbin (1030).

An upper elastic member (1051) and a lower elastic member (1052) may beinstalled respectively at an upper portion and a lower portion of thebobbin (1030). An end of the upper elastic member (1051) may beconnected to the bobbin (1030), and another end of the upper elasticmember (1051) may be coupled to the holder member (1040), but notlimited hereto. Alternatively, the other end of the upper elastic member(1051) may be coupled to the cover member (1060), as circumstancesrequires. In a case where the other end of the upper elastic member(1051) is coupled to the holder member (40), the other end of the upperelastic member (1051) may be coupled to an upper surface or a lowersurface of the holder member (1040). An end of the lower elastic member(1052) may be connected to the bobbin (1030), and another end of thelower elastic member (1052) may be coupled to an upper surface of thebase (1020), or may be coupled to a lower surface of the holder member(1040).

In addition, a protrusion for coupling of the lower elastic member(1052) may be formed on a lower side of the base (1020). A hole orrecess may be formed on the lower elastic member (1052), at a positioncorresponding to the position of the protrusion, such that the lowerelastic member (1052) can be fixed by the coupling between theprotrusion and the hole or recess. In addition, an adhesive may beadditionally used for stronger coupling. Alternatively, the protrusionand the elastic member may be coupled by a method such as thermo-weldingprocess.

Meanwhile, as illustrated in FIG. 2, the upper elastic member (1051) maybe provided as two leaf springs in a two-sectional structure. The lowerelastic member (1052) may be formed as a single body, so as to functionas a socket for being applied with current. That is, the current appliedthrough a terminal (1021 b) may be delivered through the two springs ofthe upper elastic member (1052), and the delivered current may beapplied to the first coil (1031) wound on the bobbin (1030). To thisend, the upper elastic member (1051) and the first coil (1031) may beconductively connected using a method such as soldering, respectively.

Here, the upper elastic member (1051) may include an external portioncoupled to the holder member (1040), an internal portion coupled to thebobbin (1030), and a connection portion connecting the internal portionand the external portion. The internal portion may be electricallyconnected to both ends of the first coil (1031) using a method such assoldering. That is, both distal ends of the two springs and the firstcoil (1031) may be electrically connected with each other using meanssuch as soldering, Ag epoxy, welding, conductive epoxy, etc. However,the exemplary embodiment is not limited hereto. Alternatively, in areverse way, the lower elastic member (1052) may be formed in thetwo-sectional structure, and the upper elastic member (1051) may beformed as a single body. Alternatively, the upper elastic member (1051)may be possibly formed in a four-or more multi-sectional structure.

Bidirectional movements in the optical axis direction by the bobbin(1030) may be supported by the upper elastic member (1051) and the lowerelastic member (1052). That is, the bobbin (1030) may be spaced from theholder member (1040) at a predetermined distance, such that the bobbin(1030) can be controlled to ascend and descend from the initial positionof the bobbin (1030) as a center. Alternatively, the initial position ofthe bobbin (1030) may contact an upper portion or a lower portion of theholder member (1040), such that bobbin (1030) can be controlled to moveonly upward from the initial position of the bobbin (1030) as a center.

Meanwhile, the first coil (1031) may be provided as a coil block in ashape of ring coupled to an outer circumferential surface of the bobbin(1030), but not limited hereto. That is, a coil may be directly wound onan outer circumferential surface of the bobbin (1030) to form the firstcoil (1031). As illustrated in FIG. 2, the first coil (1031) may beinstalled at a position near to a lower surface of the bobbin (1030),and may include a straight surface and a curved surface according to ashape of the bobbin (1030).

Alternatively, the first coil (1031) formed as a coil block may be in anangular shape, for example, may be in an octagonal shape. That is, thefirst coil (1031) may be all formed of straight surfaces with no curvedsurface. This is by consideration of electromagnetic interaction withthe magnet (1041) disposed oppositely. That is, the electromagneticforce can be maximized, when both surfaces of the magnet (1041) and thefirst coil (1031) facing each other are flat surfaces. However, theexemplary embodiment is not limited hereto. The surfaces of the magnet(1041) and the first coil (1031) may be formed as all curved surfaces,all flat surfaces, or one as a curved surface and the other as a flatsurface, according to its design specification.

In addition, the bobbin (1030) may include a first surface flatly formedon a surface responding to the straight surface and a second surfaceroundly formed on a surface responding to the curved surface, such thatthe first coil (1031) can be coupled to an outer circumferential surfaceof the bobbin (1030), but not limited hereto. That is, the secondsurface may be also formed as a flat surface.

The holder member (1040) may be formed as a frame roughly in a shape ofhexahedron. Coupling structures for the upper and the lower elasticmember (1051, 1052) to be coupled may be provide on an upper and a lowersurface of the holder member (1040), respectively. A magnet (1041) maybe installed at four edge portions of the holder member (1040). Here, anaccommodation portion (not illustrated in the drawings) may be formed ata position in which the magnet (1041) is to be installed as illustratedin FIG. 2. However, the present exemplary embodiment is not limitedhereto. That is, the magnet (1041) may be adhesively fixed directly toan inner circumferential surface of the holder member (1040). The magnet(1041) may be fixed by being bonded on a side surface or on an edge ofthe holder member (1040), when the magnet (1041) is directly fixed tothe holder member (1040) in such way as described in the above.

Alternatively, the lens driving device may include only a cover member(1060), without including a separate holder member (1040). The covermember (1060) may be formed of a metallic material that is aferromagnetic substance such as iron. In addition, the cover member(1060) may be provided in an angular shape when viewed from the above,so as to cover a whole of the bobbin (1030). Here, the cover member(1060) may be in a rectangular shape as illustrated in FIGS. 1 and 2.Otherwise, although it is not illustrated in the drawings, the covermember (1060) may be provided in an octagonal shape. In addition, in acase where the cover member (1060) is in an octagonal shape when viewedfrom the above, if the shape of the magnet (1041) arranged at edges ofthe holder member (1040) is a trapezoid shape when viewed from theabove, then the magnetic field emitted from edges of the holder member(1040) can be minimized.

Meanwhile, the lens driving device according to a first exemplaryembodiment may include a detection unit configured to detect motion ofthe bobbin (1030).

The detection unit may include a sensing magnet (1100) and a firstposition detection sensor (1300). Here, the first position detectionsensor (1300) may be installed at the holder member (1040).

The sensing magnet (1100) may be formed smaller and thinner than themagnet (1041). As illustrated in the drawings, the sensing magnet (1040)may be provided as a rectangle polarized into an upper and a lowerportion, but not limited hereto. The sensing magnet (1100) may be formedin a variety of shapes such as square, triangle, polygon, circle, etc.

The sensing magnet (1100) may be installed at an outer circumferentialsurface of the bobbin (1030). According to an exemplary embodiment, thesensing magnet (1100) may be fixed in a sensing magnet accommodationportion (1030 b) formed at the bobbin (1030) using such as adhesive,glue, etc. Here, the sensing magnet accommodation portion (1030 b) maybe formed as a concave groove that is concavely formed from an outercircumferential surface of the bobbin (1030), but not limited hereto.Alternatively, an accommodation portion may be formed at a positionwhere the sensing magnet (1100) can be arranged.

The concave depth of the sensing magnet accommodation portion (1030 b)may be corresponding to the thickness of the sensing magnet (1100).Alternatively, the concave depth of the sensing magnet accommodationportion (1030 b) may be formed lower or higher than the thickness of thesensing magnet (1100). In addition, the sensing magnet (1100) may befixed to the sensing magnet accommodation portion (1030 b) using such asan adhesive, such that the sensing magnet (1100) may not be protrudedout of the guide.

In addition, the sensing magnet (1100) may be arranged at a position notinterfering with the first coil (1031). That is, when the first coil(1031) is installed at a lower side of the bobbin (1030) as illustratedin FIG. 3, the sensing magnet (1100) may be arranged at an upper side ofthe bobbin (1030), or vice versa. This is in order to so locate thefirst coil (1031) as not to affect ascending/descending operations ofthe bobbin (1030) in the optical axis direction. However, the sensingmagnet (1100) may also be arranged between the first coil unit (1031)and the bobbin (1030). Alternatively, the sensing magnet (1100) may bearranged at an upper surface of the first coil (1031) facing the covermember (1060) or the cover member (1060).

The sensing magnet (1100) may be so arranged as not to face the magnet(1041), as illustrated in FIGS. 2 and 3. That is, the sensing magnet(1100) may be so arranged as to face a lateral wall of the holder member(1040) as not to face to the magnet (1041), while two or four pieces ofthe magnets (1041) may be respectively installed at internal edgeportions of the holder member (1040). The reason of such arrangement ofthe sensing magnet (1100) as not to face the magnet (1041) is, in orderto inhibit interference between magnetic force change of the sensingmagnet (1100) and magnetic force of the magnet (1041), such that thefirst position detection sensor (1300) can accurately feedback motionsof the bobbin (1030). In addition, the sensing magnet (1100) may bearranged on an upper portion or a lower portion of the magnet (1041),while not facing the magnet (1041).

In addition, the sensing magnet (1100) may be polarized into an upperand a lower portion. Therefore, the first position detection sensor(1300) may detect ascending/descending movement of the sensing magnet(1100), so as to accurately detect ascending/descending operations ofthe bobbin (1030).

The first position detection sensor (1300) may be conductively connectedto the circuit board (1021), and may output a position detection signalof the bobbin (1030). However, the present exemplary embodiment is notlimited hereto. A separate board may be arranged on a lateral wall ofthe holder member (1040), and may be conductively connected with thefirst position detection sensor (1300).

In addition, as illustrated in FIG. 4, the first position detectionsensor (1300) may be inserted in a position detection sensoraccommodation portion (1045) formed on an outer circumferential surfaceof the holder member (1040). Here, an internal side of the lateral wallon which the accommodation portion (1045) is formed may form a concaveportion, such that a thickness of the holder member (1040) can becomethe thinnest at the accommodation portion (1045). According to suchstructure, the distance between the first position detection sensor(1300) and the sensing magnet (1100) can be minimized, such that motionsof the bobbin (1030) can be detected more accurately.

In addition, as illustrated in FIG. 2, a correction magnet (1200) may beadditionally installed at a surface facing the surface where the sensingmagnet (1100) is installed. However, this is a selectable option.

The correction magnet (1200) may be installed on an outercircumferential surface of the bobbin (1030). According to an exemplaryembodiment, the correction magnet (1200) may be fixed to a correctionmagnet accommodation portion (not illustrated in the drawings) providedon the bobbin (1030) using such as adhesive. Here, the correction magnetaccommodation portion may be provided as a concave groove concavelyformed on an outer circumferential surface of the bobbin (1030), but notlimited hereto. The correction magnet accommodation portion may beformed as a rib on a position where the correction magnet (1200) can bearranged. The correction magnet accommodation portion may be provided ina same shape as that of the sensing magnet accommodation portiondescribed in the above. A concave depth of the correction magnetaccommodation portion may be formed corresponding to a thickness of thecorrection magnet (1200), or otherwise, may be formed lower of higherthan the thickness of the correction magnet (1200). Therefore, thecorrection magnet (1200) may not be protruded out of the guide, when thecorrection magnet (1200) is fixed to the correction magnet accommodationportion using such as adhesive, glue, etc.

The sensing magnet (1100) and the correction magnet (1200) may beprovided in the same size. In addition, a center of the sensing magnet(1100) may be aligned with a center of the correction magnet (1200).According to such structure, the attractive force generated among thesensing magnet (1100), the correction magnet (1200) and the cover member(1060) may be offset with one another, such that the center of thebobbin (1030) is not tilting by being attracted to the cover member(1060) side. Therefore, the bobbin (1030) may not tilt to the covermember (1060) side and may be arranged near the center where theattractive force among the sensing magnet (1100), the correction magnet(1200) and the cover member (1060) establish equilibrium. Thereby, thebobbin (1030) can possibly move in the optical axis direction, with thecenter of the bobbin (1030) aligned with the optical axis.

Meanwhile, although an exemplary embodiment where the sensing magnet(1100) and the correction magnet (1200) are so disposed as to face aflat straight surface of the cover member (1060) has been described inthe above, the present exemplary embodiment is not limited hereto. Forexample, the sensing magnet (1100) and the correction magnet (1200) maybe so disposed as to face an edge side of the cover member (1060). Insuch case, the first position detection sensor (1300) may be arranged atan edge side of the cover member (1060) at a position corresponding tothat of the sensing magnet (1100). In such case, the magnet (1041) maybe arranged at a lateral surface of the holder member (1040).

According to another exemplary embodiment, the first position detectionsensor (1300) may be arranged at the bobbin (1030), and the sensingmagnet (1100) may be arranged at the holder member (1040).Alternatively, the magnet (1041) and the sensing magnet (1100) may beused in common, such that the sensing magnet (1100) may be omitted.

The support member (1042) may support movement of the holder member(1040) in order for the handshake compensation function. The supportmember (1042) may be formed as a leaf spring or a suspension wire. Inaddition, the magnet (1041) may be arranged at an edge of the holdermember (1040), while the support member (1042) may be arranged at alateral surface of the holder member (1040), or vice versa.

The first lens driving unit (1001) may be formed as described in theabove. Otherwise, the first lens driving unit (1001) may be replacedwith an optical system implementing another auto-focusing function,instead of the structure described in the above. That is, the first lensdriving unit (1001) may be formed of an optical module using asingle-lens moving actuator or an actuator of variable reactive indextype, instead of using an auto-focusing actuator of voice coil motortype. That is, any kind of optical actuator which is able to performauto-focusing function may be used in the first lens driving unit(1001).

Meanwhile, as illustrated in FIGS. 2 and 5, the second lens driving unit(1002) may be a lens driving unit for handshake compensation function.The second lens driving unit (1002) may include the first lens drivingunit (1001), a base (1020), a support member (1042), a first circuitboard (1021), a second coil (1023), and a second position detectionsensor (1021 a). According to an exemplary embodiment, the second lensdriving unit (1002) may further include a second circuit board (1022),such that the second coil (1023) may be arranged at the second circuitboard (1022).

According to an exemplary embodiment, a control element to drive thelens driving device may be installed on the first circuit board (1021).A second coil (1023) in a pattern shape may be formed on the secondcircuit board (1022). The first and the second circuit board (1021,1022) may be conductively connected to each other. The second circuitboard (1022) may be arranged by being laminated on an upper side of thefirst circuit board (1021). However, the present exemplary embodiment isnot limited hereto. The second lens driving unit (1002) may include onlythe first circuit board (1021), without the second circuit board (1022).In such case, the second coil (1023) may be assembled on the firstcircuit board (1021) as a separate component. As illustrated in FIG. 2,the first circuit board (1021) may be provided as an FPCB, and may beinstalled at an upper surface of the base (1020).

The second circuit board (1022) may be arranged by being laminated on anupper side of the first circuit board (1021). As illustrated in FIG. 6,the second circuit board (1022) may be arranged by being adhered to thefirst circuit board (1021).

According to a first exemplary embodiment, the first circuit board(1021) and the second circuit board (1022) may be fixed at apredetermined position by the first guide portion (1400) and the secondguide portion (1500), such that the first circuit board (1021) and thesecond circuit board (1022) can be arranged as adhesively close aspossible.

The first guide portion (1400) may be integrally formed by beingprotruded on the base (1020), such that an upper surface of the firstguide portion (1400) can penetrate through the first circuit board(1021) and surface-contact a bottom surface of the second circuit board(1022). According to a first exemplary embodiment, as illustrated inFIG. 7, the first guide portion (1400) may be formed by being protrudedin a predetermined height at a position near to an inner circumferentialsurface (1020 a) of the base (1020). Here, a plurality of the firstguide portion (1400) may be formed by being protruded at a predeterminedinterval. But, the present exemplary embodiment is not limited hereto.That is, the interval between each of the first guide portions (1400)may be variable, and the first guide portion (1400) may be formed at anyposition that is not interfering with the existing components andstructures.

In addition, the height of the first guide portion (1400) may beconsistently formed. According to a first exemplary embodiment, thefirst guide portion (1400) may have a height corresponding to athickness of the first circuit board (1021). Accordingly, the firstguide portion (1400) may penetrate through a guide groove (1410)provided at the first circuit board (1021), such that an upper surfaceof the first guide portion (1400) has the same height as that of anupper surface of the first circuit board (1021). Thereby, the uppersurface of the first guide portion (1400) and the upper surface of thefirst circuit board (1021) may together support a bottom surface of thesecond circuit board (1022).

In another exemplary embodiment, although it is not illustrated, thefirst guide portion (1400) may be so provided as to penetrate throughboth of the first circuit board (1021) and the second circuit board(1022). In such case, an upper surface of the first guide portion (1400)may penetrate through a penetration hole (not illustrated) formed on thesecond circuit board (1022), while the upper surface of the first guideportion (1400) may correspond to an upper surface of the second circuitboard (1022). Here, the penetration hole may also be formed on the firstcircuit board (1021).

As illustrated in FIG. 7, the second guide portion (1500) may beprotruded on a circumferential surface of the base (1020). Here, theprotruded height of the second guide portion (1500) may be formed asbeing corresponding to the protruded height of the first guide portion(1400). The second guide portion (1500) may support a bottom of thecircumferential surface of the second circuit board (1022), such thatthe circumferential surface of the second circuit board (1022) can besuppressed from being uplifted. According to a first exemplaryembodiment, the second guide portion (1500) may be so formed as tosupport a bottom surface of the second circuit board (1022) without anyseparate adhesive member. Alternatively, an upper surface of the secondguide portion (1500) may be coated with an adhesive member, and maycontact and be fixed to the second circuit board (1022). Therefore, theposition of the first circuit board (1021) corresponding to that of thesecond guide portion (1500) may be escaped.

Meanwhile, according to a first exemplary embodiment, a grooved portion(1600) may be formed on the base (1020). The first circuit board (1021)and the second circuit board (1022) may further include a firstconnecting portion (1420) and a second connecting portion (1520)conductively connected with each other, respectively. Therefore, thefirst connecting portion (1420) and the second connecting portion (1520)of the first circuit board (1021) and the second circuit board (1022)may be fixed by soldering at first, then the grooved portion (1600) andthe first circuit board (1021) may be adhered to be fixed on the base(1021) using an adhesive member such as an epoxy. In addition, thegrooved portion (1600) may accommodate a solder ball of the firstcircuit board (1021) and the second circuit board (1022) to be arranged.

As described in the above, the first guide portion (1400) supporting abottom surface of the second circuit board (1020) may be integrallyformed with the base (1020) having relatively low dimensional deviation,such that the bottom surface of the second circuit board (1022) arrangedat an upper side of the first circuit board (1021) can directlysurface-contact the upper surface of the first guide portion (1400).Thereby, the height of the second circuit board (1022) may be constantlymaintained.

In addition, an adhesive member (not illustrated) may be additionallycoated on the upper surface of the first guide portion (1400), such thatthe upper surface of the first guide portion (1400) can be adhered toand fixed on the bottom surface of the second circuit board (1022). Atleast one of the first guide portion (1400) and the second guide portion(1500) may be provided. Alternatively, both of the first guide portion(1400) and the second guide portion (1500) may be provided.

The second coil (1510) may move the whole of the first lens driving unit(1001) in a direction of a flat surface perpendicular to the opticalaxis, through an interaction with the magnet (1041). As illustrated inFIG. 2, the second coil (1510) may be formed on the second circuit board(1022) by a pattern coil method. The second coil (1510) may be arrangedat each of edge portions of the second circuit board (1022), at aposition responding to a bottom surface of the magnet (1041).

As illustrated in FIG. 2, the second position detection sensor (1021 a)may be installed at the first circuit board (1021), but not limitedhereto. The second position sensor (1021 a) may be arranged separatelyas an independent component, or otherwise, may be arranged at the secondcircuit board (1022). Here, the second position detection sensor (1021a) may detect movement of the holder member (1040) installed with themagnet (1041) in a direction perpendicular to the optical axis, bydetecting magnetic field of the magnet (1041).

According to a first exemplary embodiment as described in the above,time consumed in auto focus operation and handshake compensationoperation can be reduced, because the movement of the bobbin (1030) inthe optical axis direction may be detected as feedback using the sensingmagnet (1100).

According to an exemplary embodiment, the bobbin (1030) may be operated,while the first coil (1031) is wound on the bobbin (1030), the sensingmagnet (1100) smaller than the auto-focusing magnet is attached to thebobbin (1030), and the first position detection sensor (1300) configuredto detect magnetic force of the sensing magnet (1100) is arranged at alateral surface of the lens driving device. Thereby, the auto focusfunction can be performed more precisely and rapidly without concern ofdegradation in response characteristic.

In particular, according to an exemplary embodiment, the bobbin (1030)may maintain a constant position with respect to the center of the covermember (1060), because the correction magnet (1200) having the same sizeand magnetic force as those of the sensing magnet (1100) may beinstalled on an opposite side of the bobbin (1030) while centers of thesensing magnet (1100) and the correction magnet (1200) are aligned witheach other, such that the bobbin (1030) is not eccentric to the covermember (1060) side.

Meanwhile, according to an exemplary embodiment, the lens driving devicehaving the sensing magnet (1100) and the correction magnet (1200) formedas illustrated in FIGS. 1 to 5 may be controlled in a single direction,and may also controlled bi-directionally. That is, the base (1020) andthe bobbin (1030) may be arranged by adhering onto their initialposition. For example, a stopper may be form the initial position bybeing protruded on the base (2020) side and contacting a bottom surfaceof the bobbin (2030). Otherwise, although it is not illustrated in thedrawings, the stopper may be protruded on the bottom surface of thebobbin (2030) and may be arranged by contacting with an upper surface ofthe base (2020). In such case, a predetermined prepress may be appliedto the upper and the lower elastic member (2051, 2052), such that theinitial position of the bobbin (2030) can adhere to the base (2020).Thus, the bobbin (2030) may ascend by the electromagnetic interaction,when electric power is applied. On the contrary, the bobbin (2030) mayreturn to the initial position by the restoring force of the upper andthe lower elastic member (2051, 2052), when the electric power is shutoff.

Alternatively, the base (1020) and the bobbin (1030) may be arranged bybeing spaced from the initial position at a predetermined distance. Insuch case, the upper and lower elastic members (1051, 1052) may beformed in a flat shape with no prepress applied. Otherwise, the upperand lower elastic members (1051, 1052) may be formed with apredetermined prepress applied. In such case, the bobbin (1030) mayascend or descend according to the polarity of current, when theelectric power is applied in the initial state where the bobbin (1030)is spaced apart from the base (1020) at a predetermined distance. Thatis, the bobbin (1030) may ascend the initial position as a standard,when a normal current is applied. In addition, the bobbin (1030) maydescend from the initial position as a standard, when a reverse currentis applied.

As described in the above, according to an exemplary embodiment, timerequired for auto-focus operation can be minimized, because moreaccurate position of the bobbin (1030) can be detected using the sensingmagnet (1100), when performing the auto-focus function by controllingthe bobbin (1030) to ascend or descend. In particular, the correctionmagnet (1200) installed at a side facing the sensing magnet (1100) mayoffset the attractive force between the sensing magnet (1100) and thecover member (1060), such that the bobbin (1030) can move while keepingconcentric with the cover member (1060) as far as possible.

The camera module may include a lens moving device formed as describedin the above, a lens barrel coupled to the bobbin (1030), an imagesensor (1011), and a PCB (1010). Here, the image sensor (1011) may bemounted on the PCB (1010). The PCB (1010) may form a bottom surface ofthe camera module.

The bobbin (1030) may include a lens barrel. At least one lens may beinstalled in the lens barrel. The lens barrel may be screw-coupled to aninside of the bobbin (1030), but not limited hereto. The lens barrel maybe directly fixed to an inside of the bobbin (1030) by other means thanthe screw-coupling, or otherwise, one or more lenses may be integrallyformed with the bobbin (1030) as a single body without the lens barrel.The lens may be formed of a single piece, or otherwise, may be formed oftwo or more lenses to compose an optical system.

An infrared cut-off filter may be additionally installed at a positonresponding to the image sensor (1011) on the base (1020). The base(1020) may be coupled to the holder member (1040). In addition, the base(1020) may support a lower side of the holder member (1040). A separateterminal member may be installed on the base (1020), in order forconductivity with the printed circuit board (1010). The terminal may beintegrally formed with the base (1020) using such as surface electrodes.Meanwhile, the base (1020) may function as a sensor holder to protectthe image sensor (1011). In such case, a protrusion may be formed in adownward direction along a side surface of the base (1020). However,this is not an essential structure. Therefore, although it is notillustrated in the drawings, a separate sensor holder may be arranged ata lower portion of the base (1020) to function as the sensor holder.

Second Exemplary Embodiment

Hereinafter, a structure of a lens driving device according to a secondexemplary embodiment will be described with reference to encloseddrawings.

FIG. 10 is an exploded perspective view illustrating a lens drivingdevice according to a second exemplary embodiment; FIG. 11 is a planview illustrating a coupled state between an FPCB and an OIS coil of alens driving device according to a second exemplary embodiment; and FIG.12 is a cross-sectional view illustrating an FPCB of a lens drivingdevice according to a second exemplary embodiment.

Referring to FIG. 10, the lens driving device according to a secondexemplary embodiment may roughly include a bobbin (2100), an AF coil(2200), a magnet (2300), a housing (2400), and may further include astator (2500), a first elastic member (2600), a second elastic member(2610), an OIS spring (2620), a base (2700), and a cover (2800). Inaddition, although it is not illustrated, the lens driving deviceaccording to a second exemplary embodiment may further include a PCB, anIR (Infrared) filter, an image sensor.

A top and a bottom of the bobbin (2100) may be opened. A center hole inshape of a cylinder may be formed on the bobbin (2100). The center holeformed on the bobbin (2100) may accommodate a lens unit (notillustrated) including at least one lens through which the light topenetrates. The lens unit may be screw-coupled to the bobbin (2100).

The AF coil (2200) may be wound at an outside of the bobbin (2100).

The magnet (2300) may be provided in plural number and facing the AFcoil (2200) wound at an outside of the bobbin (2100). Gaps between twoadjacent magnets (2300) may be arranged at a same interval in a casewhere a plural number of magnets are provided. When current flows in theAF coil (2200), an electromagnetic filed is formed at the AF coil(2200), and the magnet (2300) may electromagnetically interact with theAF coil (2200) to move the bobbin (2100) upward and downward.

A center hole may be formed on the housing (2400). A top and a bottom ofthe housing (2100) may be opened. The housing (2400) may accommodate thebobbin (2100), and the bobbin (2100) may move upward and downward in thehousing (2400). The housing (2400) may include a rib (not illustrated inthe drawings) in shape of a plate diagonally extend from a side toanother adjacent side at an inside of an edge of the housing (2400). Aninternal space of the edge of the housing (2400) may be divided into anupper portion and a lower portion by the rib. A magnet accommodatingportion may be provided, such that the magnet (2300) may be accommodatedwhile an upper surface of the magnet (2300) contacts an upper surface ofthe rib. Although it is not illustrated, the upper surface of the ribmay be so arranged as to face a lower surface of a stopper formed on anouter surface of the bobbin (2100) toward the outside.

The elastic member may be categorized by a first elastic member (2600)and a second elastic member (2610).

The first elastic member (2600) may be formed in shape of a leaf springand arranged at a lower portion of the housing (2400). A hole for thelight to penetrate through the lens unit may be formed on the firstelastic member (2600). An upper surface of the first elastic member(2600) at a periphery of the hole may contact a lower portion of thebobbin (2100), such that the first elastic member (2600) can elasticallysupport the bobbin (2100) from the housing (2400).

The second elastic member (2610) may be arranged at an upper portion ofthe housing (2400). A hole for the light to penetrate through the lensunit may be formed on the second elastic member (2610). An upper surfaceof the second elastic member (2610) at a periphery of the hole maycontact an upper portion of the bobbin (2100), such that the secondelastic member (2610) can elastically support the bobbin (2100) from thehousing (2400).

Since the first and second elastic members (2600, 2610) elasticallysupport the bobbin (2100) that is moved up/downward by the magnet(2300), the first and second elastic members (2600, 2610) may return thebobbin (2100) to its original positon. Meanwhile, the arrangement of thefirst and second elastic members (2600, 2610) is mentioned in thepresent exemplary embodiment. However, the present exemplary embodimentis not limited hereto. The first and second elastic members (2600, 2610)may be arranged variously according to the user's selection.

A pillar (2710) may be formed at each edge of the base (2700). Thehousing (2400) may be arranged at an internal side of the pillar (2710).The base (2700) may support the housing (1400) through the OIS spring(2620), such that the housing (1400) can be movable. Since the housing(2400) supported by the base (2700) is spaced apart from the pillar(2710), the housing (2400) may move in a horizontal direction within thespaced distance. However, although it is illustrated and described thatthe pillar (2710) is formed at each edge of the base (2700) in thepresent exemplary embodiment, any structure where a space formed at thebase (2700) such that the housing (2400) can move in a horizontaldirection may be implemented. A hole through which the light that haspenetrated through the lens unit can penetrate may be formed at the base(2700). The stator (2500) and the first elastic member (2600) may bearranged between the base (2700) and the housing (2400). The stator(2500) may include a coil unit (2510) and an FPCB (2520).

The coil unit (2510) may be an OIS coil, and may be arranged at a lowerside of the first elastic member (2600). The coil unit (2510) may bearranged at an upper side of the FPCB (2520). The coil unit (2510) mayinclude a hole formed to allow the light that has penetrated through thelens unit to penetrate through the hole. The first elastic member (2600)may be arranged between the coil unit (2510) and the housing (2400). Thecoil unit (2510) may face a lower portion of the magnet (2300) with apenetration hole (not illustrated) formed on the first elastic member(2600) therebetween.

To describe more particularly, the coil unit (2510) may include an OIScoil facing a lower surface of the magnet (2300). That is, an OIS coilmay be so formed at an edge of the coil unit (2510) as to face themagnet (2300). The coil unit (2510) may perform a function to compensatehandshakes of the user by moving the bobbin (2100) installed with thelens unit and the housing (2400) in horizontal directions relative tothe image sensor (to be described hereinafter). That is, a magneticfield is formed at the coil unit (2510), when the current flows in thecoil unit (2510). Thereby, the housing (2400) and the bobbin (2100)accommodated in the housing (2400) may be moved in horizontal directionsby the electromagnetic interaction with the magnet (2300).

The FPCB (2520) may apply electric power to the coil unit (2510). TheFPCB (2520) may be arranged at a lower side of the coil unit (2510). TheFPCB (2520) may include a hole where light can penetrate through thelens unit. The FPCB (2520) may transfer the current suppled through aterminal formed at a lateral side of the FPCB (2520) to the coil unit(2510) or to the OIS spring (2620). The current transferred to the OISspring (2620) may be supplied to the AF coil (2200) through the secondelastic member (2610), such that a magnetic field can be formed at theAF coil (2200) or the coil unit (2510).

The OIS spring (2620) may be arranged at a lateral surface of thehousing (2400). The OIS spring (2620) may elastically support thehousing (2400) with respect to the base (2700). The OIS spring (2620)may perform a function to return the bobbin (2100) and the housing(2400) that have moved in a horizontal direction with respect to theimage sensor (to be described hereinafter) to their original position.

Although not illustrated in the drawings, a PCB may be arranged at alower side of the base (2700). An image sensor configured to convert thelight that has penetrated through the lens module into an electricalsignal may be mounted at a periphery of an upper center of the PCB.Components for operation of the image sensor may be arranged at the PCB,or a plurality of terminals configured to supply electric power and tooutput information of the image sensor may be provided at the PCB. Inaddition, an infrared cut-off filter configured to filter an infraredray before the light that has penetrated through the lens module arrivesat the image sensor may be installed at the base (2700).

The cover (2800) may be a shield can that is arranged at an outside ofthe housing (2400) and covering the components mentioned in the above.In addition, the cover (2800) may be formed of metal. The cover (2800)may include a hole where the light can penetrate through the lens unit.

Referring to FIG. 11, the FPCB (2520) may include a terminal portion (ofwhich reference number not assigned) formed at a lateral portion andanother lateral portion facing the lateral portion, such that theterminal portion may be electrically connected to the PCB to supplyelectric power.

The FPCB (2520) may include a groove (of which reference number notassigned) at a lateral portion thereof or at a lateral portion thereoffacing another lateral portion. An OIS spring (2620) may be inserted inthe groove. In addition, the FPCB (2520) may include a penetration hole(2528) formed between a hole through which the light can penetratethrough and a terminal portion. The OIS spring (2528) may penetratethrough the penetration hole (2528). In FIG. 11, reference symbol ‘S’refers to a potion where the FPCB (2520) and the coil unit (2510) aresoldered to each other.

According to a second exemplary embodiment, the FPCB (2520) may bearranged at a lower side of the coil unit (2510). Referring to FIG. 12,the FPCB (2520) may include a base layer (2521), a circuit layer (2525),a cover layer (2526), and a copper layer (2527). The FPCB (2520) may becoupled by being soldered to the coil unit (2510).

The base layer (2521) may be formed as a plate body, and may be formedof a polyamide.

The circuit layer (2525) may be laminated on the base layer (2521). Inother words, the circuit layer (2525) may be formed on the base layer(2521) in a predetermined pattern. That is, the pattern may be formed byperforming light exposure, etching, and developing on the base layer(2521) and eliminating a dry film therefrom. In addition, the circuitlayer (2525) may be formed of a conductive material such as copper (Cu).Therefore, once the electric power is supplied to the FPCB (2520), thecurrent may flow along the predetermined pattern on the circuit of theFPCB (2520).

The cover layer (2526) may be laminated on the circuit layer (2525). Thecover layer may be formed of a coverlay film. The cover layer (2526) maybe separated from the base layer (2521) by a distance of a thickness ofthe circuit layer (2525). A separating portion (2529) may be formed at aportion where the circuit layer (2525) is not formed between the coverlayer (2526) and the base layer (2521), such that an empty space can beformed. According to the second exemplary embodiment, strength of theFPCB (2520) may be enhanced by the separating portion (2529). However,although it is described in the second exemplary embodiment that theseparating portion (2529) is provided, the cover layer (2526) may belaminated on all of the circuit layer (2525) laminated on the base layer(2521) and the portion where the circuit layer (2525) is not formed,such that the separating portion (2529) may not be present.

The circuit layer (2525) and the cover layer (2526) may be sequentiallylaminated on both surface of the base layer (2521) of the FPCB (2520).In addition, the FPCB (2520) may include a via hole (not illustrated inthe drawings) such that the both surface of the FPCB (2520) can beconductively connected to each other.

The copper portion (2527) may be disposed at an outer edge of the FPCB(2520), or may be disposed at an edge of the penetration hole (2528). Inaddition, the copper portion (2527) may be disposed at an end portion ofthe base layer (2521). To describe more particularly, the copper portion(2527) may be disposed at a first surface (2522) of the base layer(2521), a second surface (2523) facing the first surface (2522), and athird surface (2524) connecting the first surface (2522) and the secondsurface (2523). The copper portion (2527) may not be installed at eachof the first to third surfaces (2522, 2523, 2524) by being divided, butmay be formed by being extended on the first to third surfaces (2522,2523, 2524). In addition, a part (an end portion) of the copper portion(2527) may be disposed between the base layer (2521) and the cover layer(2526). In other words, the cover layer (2526) may cover an end portionof the copper portion (2527).

The copper portion (2527) may also be formed of a conductive materialsuch as copper, like the material of the circuit layer (2525). Here, ina case the circuit layer (2525) formed on the first surface (2522) andthe second surface (2523) is connected to the copper portion (2527), thecopper portion (2527) may electrically connect the circuit layers (2525)printed on the both surfaces of the FPCB (2520) with each other, justlike the via hole may do.

Although it is illustrated in FIG. 12 that the copper portion (2527) isseparated from the circuit layer (2525) via the separating portion(2529), it is one of exemplary embodiments. In another exemplaryembodiment, the copper portion (2527) may be connected to the circuitlayer (2525). The copper portion (2527) of the FPCB (2520) may besoldered to the coil unit (2510), such that the FPCB (2520) and the coilunit (2510) can be coupled to each other. Thereby, the current flowingin the circuit layer (2525) of the FPCB (2520) may be transferred to thecoil unit (2510). Therefore, the housing (2400) may be movedhorizontally relative to the optical axis by Fleming's left hand rulethrough mutual electromagnetic interaction between the magnet (2300) andthe coil unit (2510), when the current is supplied to the coil unit(2510).

Since the cover layer (2526) may not only cover the circuit layer(2525), but also may cover and support an end portion of the copperportion (2527). Thereby, the FCPB (2520) can be inhibited from beingcracked even when an impact such as dropping is applied to the lensdriving device according to an exemplary embodiment. Therefore, thedefect rate of the product can be reduced as well.

Third Exemplary Embodiment

Hereinafter, a structure of a lens driving device according to a thirdexemplary embodiment will be described with reference to encloseddrawings. Meanwhile, in describing the third exemplary embodiment, thesame reference numerals will be given to the structure same as that ofthe second exemplary embodiment, and the detailed description previouslyprovided in relationship to the second exemplary embodiment may not berepeated.

FIG. 13 is a cross-sectional view illustrating an FPCB of a lens drivingdevice according to a third exemplary embodiment.

According to the third exemplary embodiment, the FPCB (2520) may includea first FPCB (2530) and a second FPCB (2530′). Therefore, the secondexemplary embodiment may be different from the first exemplaryembodiment including one FPCB (2520).

Referring to FIG. 13, according to the third exemplary embodiment, thefirst FPCB (2530) and the second FPCB (2530′) may be formed as a platedbody, respectively. The first FPCB (2530) may include a base layer(2531), a circuit layer (2535), and a cover layer (2536). The secondFPCB (2530′) may include a base layer (2531′), a circuit layer (2535′),and a cover layer (2536′). Here, the FPCB (2520) may further include acopper layer (2537). The first FPCB (2530) and the second FPCB (2530′)may be coupled by being soldered to the coil unit (2510).

The base layer (2531, 2531′) may be formed as a plate body, and may beformed of a polyamide.

The circuit layer (2535, 2535′) may be laminated on the base layer(2531, 2531′). In other words, the circuit layer (2535, 2535′) may beformed on the base layer (2531, 2531′) in a predetermined pattern. Thatis, the pattern may be formed by performing light exposure, etching, anddeveloping on the base layer (2531, 2531′) and eliminating a dry filmtherefrom. In addition, the circuit layer (2535, 2535′) may be formed ofa conductive material such as copper (Cu). Therefore, once the electricpower is supplied to the FPCB (2520), the current may flow along thepredetermined pattern on the circuit of the FPCB (2520).

The cover layer (2536, 2536′) may be laminated on the circuit layer(2535, 2535′). The cover layer may be formed of a coverlay film. Thecover layer (2536, 2536′) may be separated from the base layer (2531,2531′) by a distance of a thickness of the circuit layer (2535, 2535′).A separating portion (2539, 2539′) may be formed at a portion where thecircuit layer (2535, 2535′) is not formed between the cover layer (2536,2536′) and the base layer (2531, 2531′), such that an empty space can beformed. According to the second exemplary embodiment, strength of theFPCB (2520) may be enhanced by the separating portion (2529). However,although it is described in the second exemplary embodiment that theseparating portion (2539, 2539′) is provided, the cover layer (2536,2536′) may be laminated on all of the circuit layer (2535, 2535′)laminated on the base layer (2531, 2531′) and the portion where thecircuit layer (2535, 2535′) is not formed, such that the separatingportion (2539, 2539′) may not be present.

The base layer (2531) of the first FPCB (2530) and the base layer(2531′) of the second FPCB (2530′) may contact each other. The circuitlayer (2525) and the cover layer (2526) may be sequentially laminated onthe base layer (2535, 2535′) of first FPCB (2530) and the second FPCB(2530′), respectively. In other words, the circuit layer (2535) may belaminated on a surface (a first surface (2532)) of the base layer (2531)of the first FPCB (2530), and the cover layer (2536) may be laminated ona surface of the circuit layer (2535). The circuit layer (2535′) may belaminated on a surface (a second surface (2533′)) of the base layer(2531′) of the second FPCB (2530′), and the cover layer (2536′) may belaminated on a surface of the circuit layer (2535′). In addition, othersurfaces not laminated with the circuit layer (2535, 2535′) of the baselayer (2531) of the first FPCB (2530) and the base layer (2531′) of thesecond FPCB (2530′) may contact each other.

In addition, the first FPCB (2530) and the second FPCB (2530′) mayinclude a via hole (not illustrated in the drawings) such that the firstFPCB (2530) and the second FPCB (2530′) can be conductively connected toeach other. The via hole may be formed in correspondence with the firstFPCB (2530) and the second FPCB (2530′).

The copper portion (2537) may be disposed at outer edges of the firstFPCB (2530) and the second FPCB (2530′), or may be disposed at an edgeof the penetration hole (2538, 2538′). In addition, the copper portion(2537) may be disposed at an end portion of the base layer (2531,2531′). To describe more particularly, the copper portion (2537) may bedisposed at a first surface (2532) of the base layer (2531) of the firstFPCB (2530), a second surface (2533′) of the second FPCB (2530′) facingthe first surface (2532), and a third surface (2534, 2534′) connecting alateral portion extended from the first surface (2532) and a lateralportion extended from the second surface (2533′). The copper portion(2537) may not be installed at each of the first to third surfaces(2532, 2533′, 2534, 2534′) by being divided, but may be formed by beingextended on the first to third surfaces (2532, 2533′, 2534, 2534′). Inaddition, a part (an end portion) of the copper portion (2537) may bedisposed between the base layer (2531) and the cover layer (2536). Inother words, the cover layer (2536, 2536′) may cover an end portion ofthe copper portion (2537).

The copper portion (2537) may also be formed of a conductive materialsuch as copper, like the material of the circuit layer (2535, 2535′).Here, in a case the circuit layer (2535, 2535′) formed on the firstsurface (2532) and the second surface (2533′) is connected to the copperportion (2537), the copper portion (2537) may electrically connect thecircuit layers (2535, 2535′) printed on surfaces of the first FPCB(2530) and the second FPCB (2530′) with each other, just like the viahole may do.

Although it is illustrated in FIG. 13 that the copper portion (2537) isseparated from the circuit layer (2535, 2535′) via the separatingportion (2539, 2539′), it is one of exemplary embodiments. In anotherexemplary embodiment, the copper portion (2537) may be connected to thecircuit layer (2535, 2535′). The copper portion (2537) of the FPCB(2520) may be soldered to the coil unit (2510), such that the FPCB(2520) and the coil unit (2510) can be coupled to each other. Thereby,the current flowing in the circuit layer (2535, 2535′) of the FPCB(2520) may be transferred to the coil unit (2510). Therefore, thehousing (2400) may be moved horizontally relative to the optical axis byFleming's left hand rule through mutual electromagnetic interactionbetween the magnet (2300) and the coil unit (2510), when the current issupplied to the coil unit (2510).

Since the cover layer (2536, 2536′) may not only cover the circuit layer(2535, 2535′), but also may cover and support an end portion of thecopper portion (2537). Thereby, the FCPB (2520) can be inhibited frombeing cracked even when an impact such as dropping is applied to thelens driving device according to an exemplary embodiment. Therefore, thedefect rate of the product can be reduced as well.

In the above, all elements composing an exemplary embodiment of thepresent disclosure have been described as being integrally combined oroperating in combination, however, the present disclosure is not limitedhereto. That is, within the scope of purpose of the present disclosure,at least one of all such elements may be selectively combined tooperate. In addition, the terms such as “include”, “comprise” or “have”are state that there may be in existence of features, numbers, steps,functions, elements, components described herein, or compositionsthereof. Therefore, they shall not be understood as to exclude thepossibility of existence or addition of one or more other features,numbers, steps, functions, elements, components described herein, orcompositions thereof.

Unless otherwise defined, all terms used herein, including technical orscientific terms, have the same meanings as those generally understoodby those with ordinary knowledge in the field of art to which thepresent disclosure belongs. Such terms as those defined in a generallyused dictionary are to be interpreted to have the meanings equal to thecontextual meanings in the relevant field of art, and are not to beinterpreted to have ideal or excessively formal meanings unless clearlydefined in the present specification.

In the above, exemplary embodiments of the present disclosure have beendescribed. However, these embodiments are merely examples and do notlimit the present invention, so that persons who skilled in the art ofthe present disclosure may easily transform and modify within the limitof the technical spirit of the present disclosure. For example, each ofthe components shown in detail in the embodiments of the presentinvention may be implemented in transformation. In addition, thedifferences relating these transformations and modifications shall beregarded to be included in the scope of the present disclosure asdefined in the attached claims of the present disclosure and theequivalents thereof.

What is claimed is:
 1. A lens driving device, comprising: a housing; abobbin disposed in the housing; a base disposed below the housing; afirst coil disposed on the bobbin; a magnet disposed on the housing andfacing the first coil; a Flexible Printed Circuit Board (FPCB) disposedon the base; a second coil disposed on the FPCB and disposed at aposition corresponding to the magnet; an elastic member connecting anupper portion of the housing and an upper portion of the bobbin; and aOptical Image Stabilization (OIS) spring configured to elasticallysupport the housing with respect to the base, wherein the FPCB comprisesa body portion disposed on an upper surface of the base, a terminalportion extending from the body portion and disposed on a lateralsurface of the base and a conductive portion formed of a conductivematerial, wherein the FPCB transfers a current suppled through aterminal formed on the terminal portion of the FPCB to the OIS spring,wherein the current transferred to the OIS spring is supplied to thefirst coil through the elastic member, wherein the FPCB comprises ahole, wherein the OIS spring penetrates through the hole, and whereinthe conductive portion comprises a first conductive portion disposed ata position adjacent to the hole.
 2. The lens driving device of claim 1,wherein the hole of the FPCB is formed between the terminal portion anda hole through which a light penetrates.
 3. The lens driving device ofclaim 1, wherein the first conductive portion is disposed on an inneredge of the hole of the FPCB.
 4. The lens driving device of claim 1,wherein the body portion of the FPCB comprises a base layer, a circuitlayer disposed on the base layer, and a cover layer disposed on thecircuit layer, wherein the circuit layer comprises a first circuit layerdisposed on a lower surface of the base layer and a second circuit layerdisposed on an upper surface of the base layer, wherein the cover layercomprises a first cover layer disposed on a lower surface of the firstcircuit layer and a second cover layer disposed on an upper surface ofthe second circuit layer, and wherein the conductive portion comprises afirst portion disposed on the lower surface of the base layer.
 5. Thelens driving device of claim 4, wherein at least a portion of the firstportion of the conductive portion is disposed between the base layer andthe first cover layer in an optical axis direction.
 6. The lens drivingdevice of claim 4, wherein the conductive portion comprises a secondportion disposed on the upper surface of the base layer and a thirdportion connecting the first portion of the conductive portion and thesecond portion of the conductive portion, and wherein at least a portionof the second portion of the conductive portion is disposed between thebase layer and the second cover layer in an optical axis direction. 7.The lens driving device of claim 4, wherein the conductive portion iscontacted with the cover layer.
 8. The lens driving device of claim 4,wherein a gap is formed between the circuit layer, the conductiveportion, the base layer, and the cover layer.
 9. The lens driving deviceof claim 4, wherein the base layer comprises two base layers separatelyformed.
 10. The lens driving device of claim 4, wherein the conductiveportion is formed of copper, and wherein the base layer comprisespolyimide.
 11. The lens driving device of claim 1, comprising a solderelectrically connecting the FPCB and the second coil, wherein theconductive portion is coupled with the solder, wherein the conductiveportion comprises a second conductive portion disposed on an outer edgeof the body portion of the FPCB.
 12. The lens driving device of claim11, wherein the first conductive portion comprises four first conductiveportions spaced apart from each other, and wherein the second conductiveportion comprises four second conductive portions spaced apart from eachother.
 13. The lens driving device of claim 11, wherein the FPCBcomprises a groove formed on the outer edge of the FPCB, and wherein thegroove of the FPCB is disposed at a position corresponding to that ofthe second conductive portion.
 14. A camera module, comprising: aprinted circuit board (PCB); an image sensor disposed on the PCB; thelens driving device of claim 1; and a lens coupled to the bobbin of thelens driving device and disposed at a position corresponding to theimage sensor.
 15. An optical apparatus, comprising the camera module ofclaim
 14. 16. A lens driving device, comprising: a housing; a bobbindisposed in the housing; a base disposed below the housing; a first coildisposed on the bobbin; a magnet disposed on the housing and facing thefirst coil; a Flexible Printed Circuit Board (FPCB) disposed on thebase; a second coil disposed on the FPCB and disposed at a positioncorresponding to the magnet; and a Optical Image Stabilization (OIS)spring configured to elastically support the housing with respect to thebase, wherein the FPCB comprises a body portion disposed on an uppersurface of the base, a terminal portion extending from the body portionand disposed on a lateral surface of the base and a conductive portionformed of a conductive material, wherein the OIS spring electricallyconnects the FPCB and the first coil, wherein the FPCB comprises a hole,wherein the OIS spring penetrates through the hole, wherein theconductive portion comprises a first conductive portion disposed at aposition adjacent to the hole, wherein the body portion of the FPCBcomprises a base layer, a circuit layer disposed on the base layer, anda cover layer disposed on the circuit layer, and wherein the firstconductive portion comprises a first portion disposed on a lower surfaceof the base layer.
 17. The lens driving device of claim 16, comprisingan elastic member connecting an upper portion of the housing and anupper portion of the bobbin, wherein the FPCB transfers a currentsuppled through a terminal formed on the terminal portion of the FPCB tothe OIS spring, and wherein the current transferred to the OIS spring issupplied to the first coil through the elastic member.
 18. The lensdriving device of claim 16, wherein at least a portion of the firstportion of the first conductive portion is disposed between the baselayer and the cover layer in an optical axis direction.
 19. The lensdriving device of claim 16, comprising a solder electrically connectingthe FPCB and the second coil, wherein the conductive portion is coupledwith the solder, wherein the conductive portion comprises a secondconductive portion disposed on an outer edge of the body portion of theFPCB.
 20. A lens driving device, comprising: a housing; a bobbindisposed in the housing; a base disposed below the housing; a first coildisposed on the bobbin; and a magnet disposed on the housing and facingthe first coil.